EMIF02-AV01F3 Datasheet, PDF (4/7 Pages) STMicroelectronics – Dual audio and video line IPAD, EMI filter and ESD protection

Ordering information scheme
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Ordering information scheme
EMIF02-AV01F3
Figure 9. Ordering information scheme
EMIF yy - xx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: lead free, pitch = 400 µm, bump = 255 µm
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 10. Package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
255 µm
910 µm ± 30 µm
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