TDA7415CB Datasheet, PDF (48/50 Pages) STMicroelectronics – Car radio multimedia signal processor

Package information
9
Package information
TDA7415CB
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 28. TQFP64 mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.17 0.22 0.27 0.0066 0.0086 0.0106
C 0.09
0.0035
D 11.80 12.00 12.20 0.464 0.472 0.480
D1 9.80 10.00 10.20 0.386 0.394 0.401
D3
7.50
0.295
e
0.50
0.0197
E 11.80 12.00 12.20 0.464 0.472 0.480
E1 9.80 10.00 10.20 0.386 0.394 0.401
E3
7.50
0.295
L 0.45 0.60 0.75 0.0177 0.0236 0.0295
L1
1.00
0.0393
K
0˚ (min.), 3.5˚ (min.), 7˚(max.)
ccc
0.080
0.0031
OUTLINE AND
MECHANICAL DATA
TQFP64 (10 x 10 x 1.4mm)
D
D1
D3
48
49
33
32
A
A2
A1
0.08mm ccc
Seating Plane
48/50
64
1
e
17
16
TQFP64
C
K
0051434 E