AIS326DQ Datasheet, PDF (47/49 Pages) STMicroelectronics – MEMS inertial sensor 3-axis, low g accelerometer with digital output

AIS326DQ
10 Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK^® is an ST trademark.
ECOPACK^® specifications are available at: www.st.com.
Figure 46. QFPN-28 mechanical data and package dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
OUTLINE AND
MECHANICAL DATA
A 1.70 1.80 1.90 0.067 0.071 0.075
A1
0.05
0.002
A3
0.203
0.008
b 0.30 0.35 0.40 0.012 0.014 0.016
D 6.85 7.0 7.15 0.270 0.275 0.281
D1 4.90 5.00 5.10 0.192 0.197 0.20
E 6.85 7.0 7.15 0.270 0.275 0.281
E1 4.90 5.00 5.10 0.192 0.197 0.20
e
0.80
0.0315
L 0.45 0.55 0.65 0.018 0..022 0.025
L1
0.10
0.004
QFPN-28 (7x7x1.8mm)
Quad Flat Package No lead
ddd
0.08
0.003
7787120 C
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