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STM32F101X4 Datasheet, PDF (45/73 Pages) STMicroelectronics – Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces | |||
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STM32F101x4, STM32F101x6
Electrical characteristics
5.3.7
Internal clock source characteristics
The parameters given in Table 23 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
High-speed internal (HSI) RC oscillator
Table 23. HSI oscillator characteristics(1)
Symbol
Parameter
Conditions
Min Typ Max Unit
fHSI
Frequency
User-trimmed with the RCC_CR
register(2)
8
MHz
1(3)
%
ACCHSI
tsu(HSI)(4)
Accuracy of the HSI
oscillator
Factory-
calibrated(4)
HSI oscillator
startup time
TA = â40 to 105 °C
TA = â10 to 85 °C
TA = 0 to 70 °C
TA = 25 °C
â2
â1.5
â1.3
â1.1
1
2.5 %
2.2 %
2
%
1.8 %
2 µs
IDD(HSI)(4)
HSI oscillator power
consumption
80 100 µA
1. VDD = 3.3 V, TA = â40 to 105 °C unless otherwise specified.
2. Refer to application note AN2868 âSTM32F10xxx internal RC oscillator (HSI) calibrationâ available from
the ST website www.st.com.
3. Guaranteed by design, not tested in production.
4. Based on characterization, not tested in production.
Low-speed internal (LSI) RC oscillator
Table 24. LSI oscillator characteristics (1)
Symbol
Parameter
Min
fLSI(2)
Frequency
30
tsu(LSI)(3) LSI oscillator startup time
IDD(LSI)(3) LSI oscillator power consumption
1. VDD = 3 V, TA = â40 to 85 °C unless otherwise specified.
2. Based on characterization, not tested in production.
3. Guaranteed by design, not tested in production.
Typ
40
0.65
Max
Unit
60
kHz
85
µs
1.2
µA
Wakeup time from low-power mode
The wakeup times given in Table 25 are measured on a wakeup phase with an 8-MHz HSI
RC oscillator. The clock source used to wake up the device depends from the current
operating mode:
â Stop or Standby mode: the clock source is the RC oscillator
â Sleep mode: the clock source is the clock that was set before entering Sleep mode.
Doc ID 15058 Rev 3
45/74
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