VNQ810M-E Datasheet, PDF (4/21 Pages) STMicroelectronics – QUAD CHANNEL HIGH SIDE DRIVER

VNQ810M-E
Figure 4. Current and Voltage Conventions
IS3,4
V_CC3,4
I_IN1
V_IN1
I_STAT1
V_STAT1
I_IN2
VIN2
ISTAT2
V_STAT2
I_IN3
V_IN3
I_STAT3
V_STAT3 ^IIN4
V_IN4 ^ISTAT4
V_STAT4
VCC3,4 VCC1,2
IS1,2
V_F1 (*)
V_CC1,2
INPUT1
STATUS1
INPUT2
STATUS2
INPUT3
STATUS3
INPUT4
STATUS4
GND_3,4
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
GND_1,2
I_OUT1
I_OUT2
V_OUT1
I_OUT3
V_OUT2
I_OUT4 ^VOUT3
V_OUT4
I_GND3,4
IGND1,2
(*) V_Fn = V_CCn - V_OUTn during reverse battery condition
Table 4. Thermal Data (Per island)
Symbol
R_thj-lead
R_thj-amb
R_thj-amb
Parameter
Thermal Resistance Junction-lead per chip
Thermal Resistance Junction-ambient (one chip ON)
Thermal Resistance Junction-ambient (two chips ON)
Value
20
60 ⁽¹⁾
44 ⁽²⁾
46 ⁽¹⁾
31 ⁽²⁾
Unit
°C/W
°C/W
°C/W
Note: 1. When mounted on a standard single-sided FR-4 board with 0.5cm² of Cu (at least 35µm thick) connected to all V_CC pins. Horizontal
mounting and no artificial air flow
Note: 2. When mounted on a standard single-sided FR-4 board with 6cm² of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow
4/21