TIP2955_08 Datasheet, PDF (4/7 Pages) STMicroelectronics – Complementary power transistors

Package mechanical data
3 Package mechanical data
TIP2955 - TIP3055
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at : www.st.com
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