English
Language : 

STD10NF30 Datasheet, PDF (4/16 Pages) STMicroelectronics – Very low intrinsic capacitances
Electrical characteristics
2
Electrical characteristics
STD10NF30
(TC = 25 °C unless otherwise specified).
Symbol
Parameter
Table 5. On /off states
Test conditions
Drain-source
V(BR)DSS breakdown voltage
(VGS = 0)
ID = 1 mA
Zero gate voltage
VDS = 300 V
IDSS
drain current (VGS = 0) VDS = 300 V, TC=125 °C
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 20 V
VGS(th) Gate threshold voltage VDS = VGS, ID = 250 μA
Static drain-source
RDS(on) on-resistance
VGS = 10 V, ID = 5 A
Min. Typ. Max. Unit
300
V
1 μA
10 μA
±100 nA
2
3
4V
0.28 0.33 Ω
Symbol
Parameter
Ciss
Coss
Crss
Qg
Qgs
Qgd
Input capacitance
Output capacitance
Reverse transfer
capacitance
Total gate charge
Gate-source charge
Gate-drain charge
Table 6. Dynamic
Test conditions
VDS = 25 V, f = 1 MHz,
VGS = 0
VDD = 240 V, ID = 10 A,
VGS = 10 V
(see Figure 14)
Min. Typ. Max. Unit
- 780 - pF
-
110
- pF
-
15
- pF
-
23
- nC
-
3.5
- nC
- 11.3 - nC
Symbol
Parameter
Table 7. Switching times
Test conditions
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
VDD = 150 V, ID = 5 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 13)
Min. Typ. Max Unit
- 13.5 - ns
- 9.5 - ns
- 32 - ns
- 9.5 - ns
4/16
DocID026136 Rev 1