HSP061-4F4 Datasheet, PDF (4/7 Pages) STMicroelectronics – 4-line ESD protection for high speed lines

Package information
2
Package information
HSP061-4F4
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 9. Flip Chip dimensions
Ø 140 µm ±15
300 µm ±40
100 µm ±15
1200 µm ±50
Figure 10. Footprint recommendations
(dimensions in mm)
Copper pad Diameter:
130 µm recommended
170 µm maximum
Solder mask opening:
230 µm minimum
Solder stencil opening:
130 µm recommended
380 µm ±20
Figure 11. Marking
Dot,
xx = marking
z = manufacturing
location
yww = datecode
y = year,
ww = week
xxz
y _ww
4/7
DocID022207 Rev 2