HSP061-4F4 Datasheet, PDF (1/7 Pages) STMicroelectronics – 4-line ESD protection for high speed lines

HSP061-4F4
4-line ESD protection for high speed lines
Flip-Chip package
6 bumps
Features
 Flow-through routing to keep signal integrity
 Ultralarge bandwidth: 13 GHz
 Ultralow capacitance: 0.5 pF
 Low leakage current: 70 nA at 25 °C
 Extended operating junction temperature
range: -40 °C to 125 °C
 Small package size: 0.72 mm²
 Very thin package: 0.380 mm typical
 RoHS compliant
Complies with following standards
 IEC 61000-4-2 level 4:
– 8 kV (contact discharge)
– 15 kV (air discharge)
Applications
The HSP061-4F4 is designed to protect against
electrostatic discharge on sub micron technology
circuits driving:
 HDMI 1.3 and 1.4
 Digital Video Interface
 Display Port
 USB 3.0
 Serial ATA
Datasheet - production data
Description
The HSP061-4F4 is a 4-channel ESD array with a
rail to rail architecture designed specifically for the
protection of high speed differential lines.
The ultra-low variation of the capacitance ensures
very low influence on signal-skew.
The device is available in a Flip-Chip package
with a 300 µm pitch, which minimizes the PCB
area.
Figure 1. Pinout (bottom view)
I/O
I/O
GND
I/O
I/O
GND
Figure 2. Functional schematic (top view)
October 2013
This is information on a product in full production.
DocID022207 Rev 2
1/7
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