TS4962M_07 Datasheet, PDF (38/41 Pages) STMicroelectronics – 3W filter-free class D audio power amplifier

Package information
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Package information
TS4962M
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK^® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 72. Pin-out for 9-bump flip-chip (top view)
IN₊
1/A1
V_DD
4/B1
IN_-
7/C1
GND
2/A2
V_DD
5/B2
STBY
8/C2
OUT_-
3/A3
GND
6/B3
OUT₊
9/C3
■ Bumps are underneath
■ Bump diameter = 300μm
Figure 73. Marking for 9-bump flip-chip (top view)
■ ST Logo
E
■ Symbol for lead-free: E
■ Two first XX product code: 62
■ third X: Assembly code
XXX
■ Three digits date code: Y for year - WW for week
YWW
■ The dot is for marking pin A1
Figure 74. Mechanical data for 9-bump flip-chip
1.60 mm
■ Die size: 1.6mm x 1.6mm ±30μm
■ Die height (including bumps): 600μm
■ Bump diameter: 315μm ±50μm
1.60 mm ^{■ Bump diameter before reflow: 300μm ±10μm}
0.5mm
■ Bump height: 250μm ±40μm
■ Die height: 350μm ±20μm
0.5mm
∅ 0.25mm
■ Pitch: 500μm ±50μm
■ Coplanarity: 50μm max
600µm
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