M24512-W_12 Datasheet, PDF (35/40 Pages) STMicroelectronics – 512-Kbit serial I²C bus EEPROM

M24512-W M24512-R M24512-DR M24512-DF
Package mechanical data
Figure 17. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package
outline
$
EB
,
,
%
0IN
%
!
!
,
$
EEE
+
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1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V_SS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 20.
Symbol
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
millimeters
inches⁽¹⁾
Typ
Min
Max
Typ
Min
Max
A
A1
b
D
D2 (rev MC)
E
E2 (rev MC)
e
K (rev MC)
L
L1
L3
eee⁽²⁾
0.550
0.020
0.250
2.000
3.000
0.500
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.300
0.300
0.300
0.080
0.600
0.050
0.300
2.100
1.600
3.100
1.600
0.500
0.150
0.0217
0.0008
0.0098
0.0787
0.1181
0.0197
0.0177
0.0000
0.0079
0.0748
0.0472
0.1142
0.0472
0.0118
0.0118
0.0118
0.0031
0.0236
0.0020
0.0118
0.0827
0.0630
0.1220
0.0630
0.0197
0.0059
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
Doc ID 16459 Rev 26
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