TDA7417 Datasheet, PDF (32/34 Pages) STMicroelectronics – Car radio audio processor

Package information
7
Package information
TDA7417
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 19. TQFP32 Mechanical Data & Package Dimensions
DIM.
MIN.
mm
TYP.
MAX.
MIN.
inch
TYP.
MAX.
A
1.60
0.063
A1 0.05
0.15 0.002
0.006
A2 1.35 1.40 1.45 0.053 0.055 0.057
B 0.30 0.37 0.45 0.012 0.015 0.018
C 0.09
0.20 0.004
0.008
D
9.00
0.354
D1
7.00
0.276
D3
5.60
0.220
e
0.80
0.031
E
9.00
0.354
E1
7.00
0.276
E3
5.60
0.220
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.039
K
0˚(min.), 3.5°(typ.), 7°(max.)
OUTLINE AND
MECHANICAL DATA
Weight: 0.20gr
TQFP32 (7 x 7 x 1.40mm)
D
D1
D3
24
25
17
16
A
A2
A1
0.10mm
.004
Seating Plane
32
1
e
9
8
TQFP32
C
K
0060661 C
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