M24256-DRMN6TP Datasheet, PDF (32/40 Pages) STMicroelectronics – 256-Kbit serial I²C bus EEPROM

Package mechanical data
M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
9
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline
32/40
1. Drawing is not to scale.
Table 18.
Symbol
TSSOP8 – 8-lead thin shrink small outline, package mechanical data
millimeters
inches⁽¹⁾
Typ.
Min.
Max.
Typ.
Min.
Max.
A
1.200
A1
0.050
0.150
A2
1.000
0.800
1.050
0.0394
b
0.190
0.300
c
0.090
0.200
CP
0.100
D
3.000
2.900
3.100
0.1181
e
0.650
0.0256
E
6.400
6.200
6.600
0.2520
E1
4.400
4.300
4.500
0.1732
L
0.600
0.450
0.750
0.0236
L1
1.000
0.0394
α
0°
8°
1. Values in inches are converted from mm and rounded to four decimal digits.
0.0020
0.0315
0.0075
0.0035
0.1142
0.2441
0.1693
0.0177
0°
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
0.2598
0.1772
0.0295
8°
Doc ID 6757 Rev 30