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STB75NH02L Datasheet, PDF (3/8 Pages) STMicroelectronics – N-CHANNEL 24V - 0.0062W -75A - D2PAK STripFET™ III POWER MOSFET
STB75NH02L
ELECTRICAL CHARACTERISTICS (CONTINUED)
DYNAMIC
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
gfs (3) Forward Transconductance VDS = 15 V , ID = 30 A
TBD
S
Ciss
Input Capacitance
VDS = 15 V, f = 1 MHz, VGS = 0
2000
pF
Coss
Output Capacitance
420
pF
Crss
Reverse Transfer
Capacitance
210
pF
Rg
Gate Input Resistance
f= 1 MHz Gate DC Bias= 0
Test Signal Level= 20 mV
Open Drain
1
Ω
SWITCHING ON
Symbol
Parameter
td(on)
tr
Turn-on Delay Time
Rise Time
Qg
Qgs
Qgd
Qoss (4)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Output Charge
SWITCHING OFF
Symbol
Parameter
td(off)
tf
Turn-off-Delay Time
Fall Time
Test Conditions
VDD = 10 V, ID = 37.5 A
RG = 4.7Ω VGS = 10 V
(see test circuit, Figure 3)
VDD = 10 V, ID =75 A,
VGS = 10 V
VDS = 16 V, VGS = 0
Test Conditions
VDD = 10 V, ID = 37.5 A,
RG = 4.7 Ω, VGS = 10 V
(see test circuit, Figure 3)
Min.
Typ.
TBD
TBD
Max.
Unit
ns
ns
35
47
nC
TBD
nC
TBD
nC
TBD
nC
Min.
Typ.
TBD
TBD
Max.
Unit
ns
ns
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
ISD
Source-drain Current
ISDM (1) Source-drain Current (pulsed)
VSD (3) Forward On Voltage
ISD = 37.5 A, VGS = 0
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 75 A, di/dt = 100A/µs,
VDD = 15V, Tj = 150°C
(see test circuit, Figure 5)
1. Garanted when external Rg = 4.7 Ω and tf < tf max
2. Starting Tj = 25°C, ID = 25A, VDD = 15V
3. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
4. Qoss = Coss*∆ Vin, Coss = Cgd+Cds. See Appendix A
5. Pulse width limited by safe operating area
Min.
Typ.
TBD
TBD
TBD
Max.
75
300
1.3
Unit
A
A
V
ns
nC
A
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