IRF830 Datasheet, PDF (3/8 Pages) NXP Semiconductors – PowerMOS transistor Avalanche energy rated

IRF830
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
S ymb ol
td(on)
t_r
P a ra m et er
Turn-on Time
Rise Time
Qg
Total Gate Charge
Q_gs Gate-Source Charge
Qgd Gate-Drain Charge
Test Conditions
VDD = 250 V ID = 2.9 A
RG = 4.7 Ω
VGS = 10 V
(see test circuit, figure 3)
VDD = 400 V ID = 3 A VGS = 10 V
SWITCHING OFF
S ymb ol
t_{r(Vo f f)}
tf
t_c
P a ra m et er
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
V_DD = 400 V I_D = 4.5 A
R_G = 4.7 Ω V_GS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
S ymb ol
P a ra m et er
Test Conditions
I_SD
I_SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
VSD (∗) Forward On Voltage
ISD = 4.5 A VGS = 0
trr
Reverse Recovery
Time
Qrr
Reverse Recovery
I_SD = 4.5 A di/dt = 100 A/µs
VDD = 100 V Tj = 150 ^oC
(see test circuit, figure 5)
Charge
IRRM Reverse Recovery
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Min.
Typ .
11.5
8
Max.
Unit
ns
ns
22
30
nC
7.2
nC
8
nC
Min.
Typ .
7
5
15
Max.
Unit
ns
ns
ns
Min.
Typ .
Max.
4.5
18
Unit
A
A
1.6
V
435
ns
3.3
µC
15
A
Safe Operating Area
Thermal Impedance
3/8