TS488 Datasheet, PDF (28/32 Pages) STMicroelectronics – Pop-free 120mW stereo headphone amplifier

Package mechanical data
5
Package mechanical data
TS488-TS489
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK^® packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
5.1
MiniSO-8 package
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