HDMI2C1-14HD Datasheet, PDF (28/32 Pages) STMicroelectronics – HPD pull down and signal conditioning

Recommendation on PCB assembly
5
Recommendation on PCB assembly
HDMI2C1-14HD
5.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 33. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect
Ratio
=
W-----
T
 1,5
Aspect Area = _{2----T---L-}---L-^---+-W----W-------_  0,66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 34. Recommended stencil window position
300 µm
13 µm
500 µm
474 µm
28/32
286 µm
7 µm
0.23
0.50
2.3 mm
5.3 mm
750 µm
3.8 mm
2.30
300 µm
1.7 mm
0.25
5.30
Stencil window
Footprint
DocID023674 Rev 2
0.30
0.50
0.25
0.45