STM32F102C6T6A Datasheet, PDF (27/69 Pages) STMicroelectronics – Low-density USB access line, ARM-based 32-bit MCU with 16/32 KB Flash, USB FS interface, 5 timers, ADC & 5 communication interfaces

STM32F102x4, STM32F102x6
Electrical characteristics
5.3
5.3.1
5.3.2
Operating conditions
General operating conditions
Table 8. General operating conditions
Symbol
Parameter
Conditions
Min Max Unit
f_HCLK
Internal AHB clock frequency
0
48
f_PCLK1 Internal APB1 clock frequency
0
24 MHz
f_PCLK2 Internal APB2 clock frequency
0
48
V_DD
Standard operating voltage
2
3.6
V
V_DDA(1)
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
2
3.6
Must be the same potential
as V_DD(2)
2.4 3.6
V
V_BAT
P_D
Backup operating voltage
Power dissipation at T_A =
85 °C⁽³⁾
LQFP48
LQFP64
1.8 3.6
V
363
mW
444
TA
Ambient temperature
Maximum power dissipation –40 85
°C
Low power dissipation⁽⁴⁾
–40 105
°C
TJ
Junction temperature range
–40 105
°C
1. When the ADC is used, refer to Table 44: ADC characteristics.
2. It is recommended to power V_DD and V_DDA from the same source. A maximum difference of 300 mV
between V_DD and V_DDA can be tolerated during power-up and operation.
3. If T_A is lower, higher P_D values are allowed as long as T_J does not exceed T_Jmax (see Table 6.2: Thermal
characteristics on page 65).
4. In low power dissipation state, T_A can be extended to this range as long as T_J does not exceed T_Jmax (see
Table 6.2: Thermal characteristics on page 65).
Operating conditions at power-up / power-down
Subject to general operating conditions for T_A.
Table 9. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
V_DD rise time rate
0
t_VDD
V_DD fall time rate
20
Max Unit

µs/V

Doc ID 15057 Rev 3
27/69