VN5E160S-E Datasheet, PDF (26/34 Pages) STMicroelectronics – Single channel high side driver for automotive applications

Package and PCB thermal data
4
Package and PCB thermal data
4.1
SO-8 thermal data
Figure 35. SO-8 PC board
VN5E160S-E
Note:
Layout condition of R_th and Z_th measurements (PCB: FR4 area= 4.8mm x 4.8mm, PCB
thickness=2mm, Cu thickness= 35µm, Copper areas: from minimum pad lay-out to 2cm²).
Figure 36. R_thj-amb Vs. PCB copper area in open box free air condition
RTHj_amb(°C /W)
110
100
90
80
70
60
0
0.5
1
1.5
2
2.5
PCB Cu heatsink area (cm^2)
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