TS4995 Datasheet, PDF (23/26 Pages) STMicroelectronics – 1.2 W fully differential audio power amplifier with selectable standby and 6 dB fixed gain

TS4995
5
Package information
Package information
To meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK^® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 59. 9-bump flip-chip package mechanical drawing
1.63 mm
– Die size: 1.63mm x 1.63mm ± 30µm
– Die height (including bumps): 600µm
– Bumps diameter: 315µm ±50µm
1.63 mm ^{– Bump diameter before reflow: 300µm ±10µm}
0.5mm
– Bumps height: 250µm ±40µm
– Die height: 350µm ±20µm
– Pitch: 500µm ±50µm
0.5mm
∅ 0.25mm
– Coplanarity: 60µm max
600µm
Figure 60. Tape and reel schematics
4
1.5
1
A
8
1
A
Die size X + 70µm
4
All dimensions are in mm
User direction of feed
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