TS472_06 Datasheet, PDF (21/24 Pages) STMicroelectronics – Very low noise microphone preamplifier with 2.0V bias output and active low standby mode

TS472
Figure 45. Marking (top view)
■ ST logo
■ Part number: 472
■ E Lead free bumps
■ Three digits datecode: YWW
■ The dot indicates pin A1
Package mechanical data
E
472
YWW
Figure 46. Flip-chip - 12 bumps
2.1 mm
■ Die size: 2.1mm x 1.6mm ± 30µm
■ Die height (including bumps): 600µm
■ Bumps diameter: 315µm ±50µm
1.6 mm _{■ Bump diameter before reflow: 300µm ±10µm}
0.5mm
■ Bump height: 250µm ±40µm
0.5mm
∅ 0.315mm
■ Die height: 350µm ±20µm
■ Pitch: 500µm ±50µm
■ Coplanarity: 50µm max
600µm
Figure 47. Tape & reel specification (top view)
4
1.5
1
A
8
1
A
Die size X + 70µm
4
All dimensions are in mm
User direction of feed
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