TS472_06 Datasheet, PDF (20/24 Pages) STMicroelectronics – Very low noise microphone preamplifier with 2.0V bias output and active low standby mode

Package mechanical data
6
Package mechanical data
TS472
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK^® packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
6.1
Flip-chip package
Figure 43. TS472 footprint recommendation
Φ=250μm
500μm
500μm
75µm min.
100μm max.
Track
Φ=400μm typ.
Φ=340μm min.
150μm min.
Non Solder mask opening
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max.)
Figure 44. Pin-out (top view)
3
C1
C2
2
OUTPUT _GS
BIAS
1
IN+
IN-
STDBY VCC
OUT+
OUT-
GND BYPASS
A ^B CD
Balls are underneath
20/24