STD3NB30 Datasheet, PDF (2/8 Pages) STMicroelectronics – N - CHANNEL 300V - 1.8ohm - 3.2A - DPAK PowerMESH MOSFET

STD3NB30
THERMAL DATA
R_thj-case
Rth j -a mb
R_thc-sink
T_l
Thermal Resistance Junction-case
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature F or Soldering Purpose
3 .1 2
1 00
1. 5
2 75
o_C/W
oC/W
o_C/W
o_C
AVALANCHE CHARACTERISTICS
Symbo l
I_AR
E_AS
P a ra met er
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T_j max)
Single Pulse Avalanche Energy
(starting T_j = 25 ^oC, I_D = I_AR, V_DD = 50 V)
Max Value
3. 2
50
Unit
A
mJ
ELECTRICAL CHARACTERISTICS (T_case = 25 ^oC unless otherwise specified)
OFF
Symbo l
V _{(BR)D SS}
I_DSS
I_GSS
P ar am et e r
Test Conditions
Dr ain- s our c e
Breakdown Voltage
I_D = 250 µA V_GS = 0
Zero Gate Voltage
V_DS = Max Rat ing
Drain Current (V_GS = 0) V_DS = Max Rat ing
T_c = 125 ^oC
Gate-body Leakage
Current (VDS = 0)
V_GS = ± 30 V
Min.
300
Typ. Max.
1
10
± 100
Unit
V
µA
µA
nA
ON (∗)
Symbo l
V_GS(th)
R_DS(on)
I_{D(o n)}
P ar am et e r
Test Conditions
Gat e Threshold Voltage V_DS = V_GS
I_D = 250 µA
Static Drain-source On V_GS = 10V
Resistance
I_D =1.6 A
On State Drain Current V_DS > I_{D(o n)} x R_{DS(on )max}
V_GS = 10 V
Min.
3
Typ.
4
1.8
Max.
5
2
Unit
V
Ω
3.2
A
DYNAMIC
Symbo l
g_fs (∗)
C_iss
C_oss
C_rss
P ar am et e r
Forward
Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
V_DS > I_{D(o n)} x R_{DS(on )ma x} I_D =1.6 A
Min.
0.5
Typ.
1.3
Max.
Unit
S
V_DS = 25 V f = 1 MHz V_GS = 0
260
pF
55
pF
7
pF
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