STD30NF03L Datasheet, PDF (2/8 Pages) STMicroelectronics – N - CHANNEL 30V - 0.020 ohm - 30A DPAK STripFET POWER MOSFET

STD30NF03L
THERMAL DATA
R_{th j-pc b}
R _{th j -a mb}
R_{t hj-s ink}
T_l
Thermal Resistance Junction-PC Board
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Maximum Lead Temperature F or Soldering
Pu r pos e
Max
Max
Typ
3.75
100
1. 5
275
o_C/W
o_C/W
o_C/W
o_C
ELECTRICAL CHARACTERISTICS (T_case = 25 ^oC unless otherwise specified)
OFF
Symbo l
V _{(BR)D SS}
I_DSS
I_GSS
P ar am et e r
Test Conditions
Dr ain- s our c e
Breakdown Voltage
I_D = 250 µA V_GS = 0
Zero Gate Voltage
V_DS = Max Rat ing
Drain Current (V_GS = 0) V_DS = Max Rat ing
T_c = 125 ^oC
Gate-body Leakage
Current (V_DS = 0)
V_GS = ± 20 V
Min.
30
Typ. Max.
1
10
± 100
Unit
V
µA
µA
nA
ON (∗)
Symbo l
V_GS(th)
R_DS(on)
I_{D(o n)}
P ar am et e r
Test Conditions
Gat e Threshold Voltage V_DS = V_GS I_D = 250 µA
Static Drain-source On V_GS = 10 V
Resistance
V_GS = 4.5 V
I_D = 15 A
I_D = 15 A
On State Drain Current V_DS > I_{D(o n)} x R_{DS(on )max}
V_GS = 10 V
Min.
1
30
Typ.
1.7
0.020
0.028
Max.
2.5
0.025
0.035
Unit
V
Ω
Ω
A
DYNAMIC
Symbo l
g_fs (∗)
C_iss
C_oss
C_rss
P ar am et e r
Forward
Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
V_DS > I_{D(o n)} x R_{DS(on )ma x} I_D = 15 A
Min.
Typ.
13
Max.
Unit
S
V_DS = 25 V f = 1 MHz V_GS = 0 V
830
pF
230
pF
92
pF
2/8