STD12NE06 Datasheet, PDF (2/10 Pages) STMicroelectronics – N - CHANNEL 60V - 0.08ohm - 12A - IPAK/DPAK SINGLE FEATURE SIZE POWER MOSFET

STD12NE06
THERMAL DATA
R_thj-case Thermal Resistance Junction-case
Max
4. 3
o_C/W
R_thj-amb Thermal Resistance Junction-ambient
Max
100
o_C/W
R_thc-sink Thermal Resistance Case-sink
Typ
1. 5
o_C/W
T_l
Maximum Lead Temperature F or Soldering Purpose
275
o_C
AVALANCHE CHARACTERISTICS
Symbo l
I_AR
E_AS
P a ra met er
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T_j max)
Single Pulse Avalanche Energy
(starting T_j = 25 ^oC, I_D = I_AR, V_DD = 25 V)
Max Value
12
45
Unit
A
mJ
ELECTRICAL CHARACTERISTICS (T_case = 25 ^oC unless otherwise specified)
OFF
Symbo l
V _{(BR)D SS}
I_DSS
I_GSS
P ar am et e r
Test Conditions
Dr ain- s our c e
Breakdown Voltage
I_D = 250 µA V_GS = 0
Zero Gate Voltage
V_DS = Max Rat ing
Drain Current (V_GS = 0) V_DS = Max Rat ing
T_c = 100 ^oC
Gate-body Leakage
Current (VDS = 0)
V_GS = ± 20 V
Min.
60
Typ. Max.
1
10
± 100
Unit
V
µA
µA
nA
ON (∗)
Symbo l
V_GS(th)
R_DS(on)
I_{D(o n)}
P ar am et e r
Test Conditions
Gat e Threshold Voltage V_DS = V_GS I_D = 250 µA
Static Drain-source On V_GS = 10V I_D = 6 A
Resistance
On State Drain Current V_DS > I_{D(o n)} x R_{DS(on )max}
V_GS = 10 V
Min.
2
Typ.
3
0.08
Max.
4
0.10
Unit
V
Ω
12
A
DYNAMIC
Symbo l
g_fs (∗)
C_iss
C_oss
C_rss
P ar am et e r
Forward
Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
V_DS > I_{D(o n)} x R_{DS(on )ma x} I_D =6 A
V_DS = 25 V f = 1 MHz V_GS = 0
Min.
Typ.
6
Max.
Unit
S
760 1000 pF
100 140
pF
30
45
pF
2/10