TDA7850 Datasheet, PDF (15/18 Pages) STMicroelectronics – 4 x 50 W MOSFET quad bridge power amplifier plus HSD

TDA7850
5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK^®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 21. Flexiwatt25 (vertical) mechanical data and package dimensions
DIM.
A
MIN.
4.45
mm
TYP.
4.50
MAX. MIN.
4.65 0.175
B 1.80 1.90 2.00 0.070
C
1.40
D 0.75 0.90 1.05 0.029
E 0.37 0.39 0.42 0.014
F (1)
0.57
G 0.80 1.00 1.20 0.031
G1 23.75 24.00 24.25 0.935
H (2) 28.90 29.23 29.30 1.139
H1
17.00
H2
12.80
H3
0.80
L (2) 22.07 22.47 22.87 0.869
L1 18.57 18.97 19.37 0.731
L2 (2) 15.50 15.70 15.90 0.610
L3 7.70 7.85 7.95 0.303
L4
5
L5
3.5
M 3.70 4.00 4.30 0.145
M1 3.60 4.00 4.40 0.142
N
2.20
O
2
R
1.70
R1
0.5
R2
0.3
R3
1.25
R4
0.50
V
5˚ (T p.)
V1
3˚ (Typ.)
V2
20˚ (Typ.)
V3
45˚ (Typ.)
(1): dam-bar protusion not included
(2): molding protusion included
inch
TYP.
0.177
0.074
0.055
0.035
0.015
0.040
0.945
1.150
0.669
0.503
0.031
0.884
0.747
0.618
0.309
0.197
0.138
0.157
0.157
0.086
0.079
0.067
0.02
0.12
0.049
0.019
MAX.
0.183
0.079
0.041
0.016
0.022
0.047
0.955
1.153
0.904
0.762
0.626
0.313
0.169
0.173
OUTLINE AND
MECHANICAL DATA
Flexiwatt25 (vertical)
V
B
V3
Pin 1
H3
G
C
V
H
H1
H2
A
R3
R4
V1
R2
N
R
L L1
V1
V2
G1
F
R2
R1
D
L5
FLEX25ME
R1 R1
E
M M1
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