LIS33DE Datasheet, PDF (15/31 Pages) STMicroelectronics – MEMS motion sensor 3-axis - ±2g/±8g smart digital output “nano” accelerometer

LIS33DE
4
Application hints
Figure 5. LIS33DE electrical connection
Vdd
Application hints
10uF
Vdd_IO
100nF
16
1
14
13
TOP VIEW
INT
5
6
9
8
GND
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
The device core is supplied through Vdd line while the I/O pads are supplied through
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be
placed as near as possible to the pin 14 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I²C/SPI interface.When using the I²C, CS must be tied high.
The functions, the threshold and the timing of the interrupt pin (INT) can be completely
programmed by the user through the I²C/SPI interface.
4.1
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020C.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Doc ID 15596 Rev 1
15/31