CD00257532 Datasheet, PDF (15/19 Pages) STMicroelectronics – Application information

L4949ED-E, L4949EP-E
Package and packing information
4
Package and packing information
4.1
ECOPACK^® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
4.2
SO-8 TP package information
Table 9. SO-8 TP mechanical data
Dim.
Min.
mm
Typ.
Max.
A
1.75
a1
0.1
0.25
a2
1.65
a3
0.65
0.85
b
0.35
0.48
b1
0.19
0.25
C
0.25
0.5
c1
45° (typ.)
D⁽¹⁾
4.8
5.0
E
5.8
6.2
e
1.27
e3
3.81
F⁽¹⁾
3.8
4.0
L
0.4
1.27
M
0.6
S
8° (max.)
1. D and F do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm
(.006inch).
Doc ID 16823 Rev 1
15/19