SP1ML Datasheet, PDF (14/27 Pages) STMicroelectronics – SPIRIT1 868 and 915 MHz low power RF modules with integrated microcontroller

Hardware design
SP1ML
Table 8. Soldering profile (continued)
Profile feature
Time maintained above:
– Temperature T_L
– Temperature T_L
Peak temperature (T_P)
Time within 5 °C of actual peak temperature (T_P)
Ramp-down rate
Time from 25 °C to peak temperature
Lead-free assembly
217 °C
60-70 sec
240 °C
10-20 sec
6 °C/sec
8 minutes max.
Figure 6. Soldering profile
GSPG1409141835SMD
14/27
DocID026906 Rev 4