SP1ML Datasheet, PDF (13/27 Pages) STMicroelectronics – SPIRIT1 868 and 915 MHz low power RF modules with integrated microcontroller

SP1ML
2.4
Recommended footprint
Figure 5. Recommended footprint
 PP
Hardware design
 PP
 PP
PP
 PP
*63*60'
2.5
Module reflow installation
The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final
assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-
020C, July 2004 recommendations.
Table 8. Soldering profile
Profile feature
Average ramp-up rate (T_SMAX to T_P)
Preheat:
– Temperature min. (T_S min.)
– Temperature max. (T_S max.)
– Time (t_s min. to t_s max.)(t_s)
Lead-free assembly
3 °C/sec max
150 °C
200 °C
60-100 sec
DocID026906 Rev 4
13/27
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