VS6552 Datasheet, PDF (13/26 Pages) STMicroelectronics – VGA Color CMOS Image Sensor Module

VS6552
4.3 ESD Handling Characteristics
6 DEFECT CATEGORIZATION
Table 15. ESD Handling Limits
Test
Method
Criteria
ESD Human
Body Model
JESD22 A114A
2kV
ESD Machine
Model
JESD22 A115A
200V
Latch Up
JESD78
1.5 * Vddmax,
150mA
5 OPTICAL SPECIFICATION
The small amount of lens relative illumination ef-
fects (field darkening) is corrected by the
STV0974.
Table 16. Optical Specifications
Parameter
Value
Effective Focal Length
4 mm ± 0.15 mm
Aperture
F2.8 aperture
Horizontal Field of View
45^o ± 2^o
TV Distortion
(pin,cushion & barrel)
-3% to 3%
MTF (Figure 6.)
@ 60 cm @ 45 cycle/mm
– On axis: 45 %
– Horizontal field: 30%
– Diagonal field: 30%
Figure 6. MTF Points on the Image Field
6.1 Pixel Defects
A packaged CMOS image sensor will display visu-
al imperfections caused either by electrical faults
or optical blemishes which can be introduced in
the product at various stages of the manufacturing
process. These impurities can result in pixel de-
fects, that is a pixel whose output is not consistent
with the level of incident light falling on the image
sensor. The ability to identify and correct these de-
fects is central to both the design requirements
and quality certification, via test of STMicroelec-
tronics sensor products.
The STMicroelectronics STV0974 co-processor
implements defect correction algorithms which
screens the presence of these defects in the final
images. The defect correction algorithms ensure
that the VS6552 sensor in conjunction with the
STV0974 co-processor will produce a high quality
final image.
7 PACKAGE MECHANICAL DATA
7.1 SmOP1.5 Module Outline
– Figure 7
– Figure 8
– Figure 9
7.2 SmOP2 M Module Outline
– Figure 10
– Figure 11
– Figure 12
on axis
horizontal
field
7.3 SmOP2 ME Module Outline
– Figure 13
– Figure 14
– Figure 15
diagonal
field
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