RHFL4913A Datasheet, PDF (13/20 Pages) STMicroelectronics – Rad-hard adjustable positive voltage regulator

RHFL4913A
Die information
7.1
Die bonding pad locations and electrical functions
Die physical dimensions:
Die size: 150 mils x 110 mils (3.81 mm by 2.79 mm)
Die thickness: 375 µm ± 25 µm (14.8 mils ± 1 mil)
Pad size: V_IN, V_OUT pads: 450 µm x 330 µm (17.7 mils by 13 mils)
Control pads: 184 µm x 184 µm (7.25 mils square)
Interface materials:
Top metallization: Al/Si/Cu, 1.05 µm ± 0.15 µm
Backside metallization: none
Glassivation:
Type: p. vapox + nitride
Thickness: 0.6 µm ± 0.1 µm + 0.6 µm ± 0.08 µm
Substrate: bare silicon
Assembly related information:
Substrate potential: floating recommended to be tied to ground
Special assembly instructions: "Sense" pad not used; not internally connected to
any part of the IC. Can be connected to ground when space anti-static electricity
rules apply.
Doc ID 10005 Rev 11
13/20