STM8AF526X Datasheet, PDF (122/125 Pages) STMicroelectronics – Automotive 8-bit MCU, with up to 128 Kbyte Flash, data EEPROM, 10-bit ADC, timers, LIN, CAN, USART, SPI, I2C, 3 to 5.5 V

Revision history
STM8AF526x/8x/Ax STM8AF6269/8x/Ax
Date
18-Jul-2012
31-Mar-2014
Table 55. Document revision history (continued)
Revision
Changes
9
(continued)
Table 26: Total current consumption in Run, Wait and Slow mode.
General conditions for VDD apply, TA = -40 °C to 150 °C: updated
conditions for I_DD(RUN).
Table 38: I/O static characteristics: added new condition and new
max values for rise and fall time; updated footnote 2.
Section 10.3.7: Reset pin characteristics: updated text below
Figure 38: Typical NRST pull-up current Ipu vs VDD
Figure 39: Recommended reset pin protection: updated unit of
capacitor.
Table 41: SPI characteristics: updated SCK high and low time
conditions and values.
Figure 42: SPI timing diagram - master mode: replaced ‘SCK input’
signals with ‘SCK output’ signals.
Updated Table 49: LQFP80 - 80-pin, 14 x 14 mm low-profile quad flat
package mechanical data, Table 50: LQFP64 - 64-pin, 10 x 10 mm
low-profile quad flat package mechanical data, Table 51: LQFP48 -
48-pin, 7 x 7 mm low-profile quad flat package mechanical data,
Table 52: LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package
mechanical data, Table 53: VFQFPN32 - 32-pin, 5 x 5 mm, 0.5 mm
pitch very thin profile fine pitch quad flat package mechanical data
Replaced Figure 48: LQFP64 - 64-pin, 10 x 10 mm low-profile quad
flat package outline, Figure 51: LQFP48 - 48-pin, 7 x 7 mm low-
profile quad flat package outline and Figure 54: LQFP32 - 32-pin, 7 x
7 mm low-profile quad flat package outline
Added Figure 49: LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat
package recommended footprint, Figure 52: LQFP48 - 48-pin, 7 x
7 mm low-profile quad flat package recommended footprint and
Figure 55: LQFP32 - 32-pin, 7 x 7 mm low-profile quad flat package
recommended footprint
Updated Figure 57: VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very
thin profile fine pitch quad flat package outline
Updated Figure 60: STM8AF526x/8x/Ax and STM8AF6269/8x/Ax
ordering information scheme1
Section 13.2.2: C and assembly toolchains: added www.iar.com.
Updated:
– Table 1: Device summary,
– Table: STM8AF52xx product line-up with CAN,
– Table: STM8AF/H/P51xx product line-up with CAN,
– Table: STM8AF/H/P61xx product line-up without CAN,
– Table 11: STM8AF526x/8x/Ax and STM8AF6269/8x/Ax pin
description,
10
– The maximum speed in Section 5.9.3: Serial peripheral interface
(SPI),
– t_TEMP Reset release delay /VDD rising typical and max values in
Table 25: Operating conditions at power-up/power-down,
– The symbol t_IFP(NRST) with t_INFP(NRST) in Table 39: NRST pin
characteristics,
– The address and comment for Reset in Table 17: STM8A interrupt
table.
122/125
DocID14395 Rev 15