CLT3-4B Datasheet, PDF (11/13 Pages) STMicroelectronics – Current limited over-voltage protected quad digital termination

CLT3-4B
3
Package information
Package information
● Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. TSSOP20 dimensions
Dimensions
Ref.
Millimeters
Inches
D
aaa C
20
1
A2 A
b
A1
11
E
10
e
E1
C
Seating
plane
C
0.25 mm
Gage plane
k
L
L1
Min. Typ. Max. Min. Typ. Max.
A
1.2
0.047
A1 0.05
0.15 0.002
0.006
A2 0.8 1.0 1.05 0.031 0.039 0.041
b 0.19
0.3 0.007
0.012
c 0.09
0.2 0.003
0.007
D 6.4 6.5 6.6 0.252 0.256 0.259
E 6.2 6.4 6.6 0.244 0.252 0.256
E1 4.3 4.4 4.5 0.169 0.173 0.177
e
0.65
0.026
L 0.45 0.6 0.75 0.017 0.023 0.029
L1
k 0°
aaa
1.0
8°
0.1
0.039
0°
8°
0.004
Figure 13. TSSOP20 footprint (dimensions in mm)
7.26
4.93
0.36
6.21
0.65
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