D10 Datasheet, PDF (10/13 Pages) STMicroelectronics – Memory Micromodules General Information for D1, D2 and C Packaging

DIE SIDE _{CROSS SECTION}
8.12
0.58 max
7 ^maR1x.3
CONTACT SIDE
9.5
R0.15^1.422
(P)ø2.2
0.16
0.1
2.2min
2.54
(M)ø1^4..755 _5.2±0.2
NOTE:
- (P) is reject identification hole ø2.2
- (M) may be punched with (P): center positioning ±0.2
- Sproket holes may be with or without metalisation
- Recommended punching contour for the customer: 8.32*11
- Minimal contact area according to ISO 7816-1
R1.4
Copyright SGS-THOMSON Microelectronics. Unauthorized reproduction and communication is stricly
GRAPHIC TITLE:
POA FOR MICROMODULE D15
SCALE
none
DATUM
06/1998
GENERAL TOLERANCE IS ±0.1 mm
ALL DIMENSIONS ARE IN MILLIMETERS
Measurements are subject to change without notice
Z.I. de Rousset
B.P. 2 - 13106 ROUSSET CEDEX
Tel. [phone]
Fax [phone]
PACKAGE CODE GRAPHICS REV.
FU
A
DRAWN BY:
ROYER.G
CONTROLED BY:
STEFFEN.F