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STB10NB50 Datasheet, PDF (1/8 Pages) STMicroelectronics – N - CHANNEL 500V - 0.55ohm - 10.6A - D2PAK PowerMESH] MOSFET
®
STB10NB50
N - CHANNEL 500V - 0.55Ω - 10.6A - D2PAK
PowerMESH™ MOSFET
TYPE
ST B10 NB5 0
V DSS
500 V
RDS( on )
< 0.60 Ω
ID
10.6 A
s TYPICAL RDS(on) = 0.55 Ω
s EXTREMELY HIGH dv/dt CAPABILITY
s 100% AVALANCHE TESTED
s VERY LOW INTRINSIC CAPACITANCES
s GATE CHARGE MINIMIZED
s ADD SUFFIX ”T4” FOR ORDERING IN TAPE
& REEL
DESCRIPTION
Using the latest high voltage MESH OVERLAY™
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
s HIGH CURRENT, HIGH SPEED SWITCHING
s SWITCH MODE POWER SUPPLIES (SMPS)
s DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
3
1
D2PAK
TO-263
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
S ymb ol
Parameter
VDS
V DGR
VGS
ID
ID
IDM(•)
Ptot
Drain-source Voltage (VGS = 0)
Drain- gat e Voltage (RGS = 20 kΩ)
Gate-source Voltage
Drain Current (cont inuous) at Tc = 25 o C
Drain Current (cont inuous) at Tc = 100 oC
Drain Current (pulsed)
T otal Dissipation at Tc = 25 oC
Derating Factor
dv/dt(1) Peak Diode Recovery voltage slope
Ts tg Storage T emperature
Tj
Max. Operating Junction T emperature
(•) Pulse width limited by safe operating area
Value
Unit
500
V
500
V
± 30
V
10.6
A
6.4
A
42.4
A
135
1.08
W
W /o C
4.5
V/ns
-65 to 150
oC
150
oC
( 1) ISD ≤ 10.6A, di/dt ≤ 200 Α/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
March 1999
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