QFP-EP Datasheet, PDF (2/2 Pages) STATS ChipPAC, Ltd. – Exposed Pad Quad Flat Pack

QFP-ep
Exposed Pad Quad Flat Pack
SPECIFICATIONS
Die Thickness
304-482µm (12-19mils) range preferred
Gold Wire
25/30µm (1.0/1.2mils) diameter, 99.999% Au
Lead Finish
85/15 Sn/Pb or Matte Tin
Marking
Laser/ink
Packing Options JEDEC tray/tape and reel
RELIABILITY
Moisture Sensitivity Level
Temperature Cycling
High Temperature Storage
Pressure Cooker Test
Liquid Thermal Shock (opt)
JEDEC Level 3
-65°C/150°C, 1000 cycles
150°C, 500 hrs
121°C 100% RH,
2 atm, 168 hrs
-55°C/125°C, 1000 cycles
THERMAL PERFORMANCE, θja (°C/W)
Package
Body Size (mm)
Pad Size (mm)
48L
7 x 7 x 1.0
5.5 x 5.5
Die Size (mm)
5.3 x 5.3
PCB Vias Thermal Performance, θja (°C/W)
25
26.9
64L
10 x 10 x 1.0
6.5 x 6.5
6.0 x 6.0
36
24.0
80L
12 x 12 x 1.0
7.2 x 7.2
6.0 x 6.0
36
23.0
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Component
Length
(mm)
Resistance
(mOhms)
Inductance
(nH)
Inductance
Mutual (nH)
Capacitance Capacitance
(pF)
Mutual (pF)
Wire
2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (14 x 14mm, 100L)
Total (14 x 14mm, 100L)
Wire
4.4 - 5.9
2
30.5 - 41.4
150.5 - 161.4
120
1.52 - 2.07
3.17 - 3.72
1.65
0.70 - 0.93
1.15 - 1.78
0.45 - 0.85
0.70 - 0.95
0.8 - 1.05
0.10
0.39 - 0.52
0.4 - 0.54
0.01 - 0.02
Lead (20 x 20mm, 144L)
Total (20 x 20mm, 144L)
4.2 - 6.1
29.3 - 42.8
149.3 - 162.8
1.47 - 2.14
3.12 - 3.79
0.68 - 0.98
1.13 - 1.83
0.75 - 1.10
0.85 - 1.20
0.44 - 0.65
0.45 - 0.67
CROSS-SECTION
TQFP-ep
LQFP-ep
PACKAGE CONFIGURATIONS
Package Size
Lead Count
0.80mm 0.65mm 0.50mm 0.40mm
TQFP-ep 7 x 7 x 1.0
32
-
48
-
10 x 10 x 1.0 44, 48
52
64
-
12 x 12 x 1.0
52
64
80
100
14 x 14 x 1.0
64
80
100
-
LQFP-ep 10 x 10 x 1.4
-
-
64
-
14 x 14 x 1.4
64
80
100
-
20 x 20 x 1.4
96
128 144 164
24 x 24 x 1.4
-
-
-
216
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©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005