QFP-EP Datasheet, PDF (1/2 Pages) STATS ChipPAC, Ltd. – Exposed Pad Quad Flat Pack

QFP-ep
Exposed Pad Quad Flat Pack
• 7 x 7mm to 24 x 24mm body sizes
• 32 to 216 lead count
• Lead pitch range from 0.80mm
to 0.40mm
FEATURES
• Body Sizes: 7 x 7mm to 24 x 24mm
• Package Height: 1.0mm (TQFP-ep) and 1.4mm
(LQFP-ep)
• Lead Counts: 32L to 216L
• Lead Pitch: 0.40mm to 0.80mm
• Wide range of open tool leadframe and die pad
sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available
APPLICATIONS
• ASIC
• DSP
• Gate Array
• Logic, Microprocessors/Controllers
• Multimedia, PC Chipsets, Others
DESCRIPTION
STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a
thermally enhanced version of the QFP package. Thermal
enhancement is achieved by means of an exposed die pad,
which can be soldered to a mother PC board for effective
heat removal and grounding. STATS ChipPAC’s QFP-ep family
includes the Exposed Pad-Low Profile QFP (LQFP-ep) and
the Exposed Pad-Thin QFP (TQFP-ep). These enhanced
thermal packages are made possible by deep downset die
pad leadframe design combined with well controlled low
loop wirebonding and package warpage control during the
molding process.
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