FHA3C64X-H Datasheet, PDF (9/21 Pages) STANLEY ELECTRIC CO.,LTD. – Blowhole is a type of defect which mostly occurs in direct mounting LED.

Soldering Conditions
FHA3C64X-H
1 Soldering Precaution
1） Please avoid dipping the resin directly into the solder bath.
2） Please do not apply the heat of 100 ˆ or more to the resin.
3） Any shock or vibration to the LED resin body should be avoided after soldering for the resin is
soft and easily to be damaged until it return to room temperature.
4） Heating up for temporarily fix of other surface-mounting device should be done under 100ˆ.
Avoid any pressure to the frame and resin part of LED.
5） The tie-bar cutting part might get oxidized because iron has been exposed. Please avoid
soldering on the tie-bar part, because the solderability decreases when oxidization
occurs. When the soldering part and die-bar cutting part overlaps, please confirm the
solderability before using.
2 Recommendation Condition of Soldering
1） ^{Soldering iron}
Temperature at tip of iron ： 360ˆ MAX.
Soldering time ： 3s MAX.
˞ ^Position ： At least 1.6mm away from the root of lead
The number of manual soldering process shall be 2 times Max.
Cooling process to room temp. is required between first and second manual soldering process.
2） Dip Soldering
Pre-heating ： Resin surface temperature should be set under 100ˆ.
Bath temperature ： 265ˆ MAX.
Dipping time ： 5s MAX.
˞ ^{Position ： At least 1.6mm away from the root of lead.}
The number of dip soldering process shall be 2 times Max.
Cooling process to room temp. is required between first and second dip soldering process.
˞ ^{Soldering positioning}
Note Through hole board is not recommended because soldering position will become 0 mm.
2012.12.04
Both sides through hole board One side board
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