FHA3C64X-H Datasheet, PDF (12/21 Pages) STANLEY ELECTRIC CO.,LTD. – Blowhole is a type of defect which mostly occurs in direct mounting LED.

Handling precaution
FHA3C64X-H
【 2. Lead Forming 】
1）
The lead frame should be bent at a point 2mm away from the root of lead.
Please perform at room temperature.
2） During forming, a jig or radio pliers should be firmly fixed to the root of lead, to which no mechanical
stress should be applied.
3） All forming must be performed prior to soldering.
4） Forming pitch should be adjusted to the device insertion hole-pitch on the PCB.
5） Please avoid bending at the tie-bar part of lead during foaming because
there is possibility that the stable forming shape can not be formed.
Tie-bar portion
【 3. LED Mounting method 】
1） Please avoid excessive stress to lead frames during mounting. Mounting should be performed at
room temperature.
2） ^{To determine mount positions of LEDs using a case, please take into account the dimensions of the}
casing, board , device to avoid excessive stress on the lead.
3） ^{Please fix the LED within the casing using the lead, and do not use adhesives, resin, or any other}
materials to fix the LED position.
4） ^{With regard to using an inserter (automation), please adjust the insertion pressure to the lowest}
possible setting, and minimize the clinch angel as for as it can hold the component.
<ex.> Clinch angle ：Cathode 15°MIN.
Anode 45°MIN.
Pusher pressure ： _{0.2MPa MAX.}
Lead width
0.4mm
Holes between pitches on board
φ0.7～1.0mm
2012.12.04
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