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SST39VF1601C Datasheet, PDF (20/39 Pages) Silicon Storage Technology, Inc – 16 Mbit (x16) Multi-Purpose Flash Plus
A Microchip Technology Company
16 Mbit Multi-Purpose Flash Plus
SST39VF1601C / SST39VF1602C
AC Characteristics
Data Sheet
Table 17:Read Cycle Timing Parameters VDD = 2.7-3.6V
Symbol Parameter
Min
Max
Units
TRC
Read Cycle Time
70
ns
TCE
Chip Enable Access Time
70
ns
TAA
Address Access Time
70
ns
TOE
Output Enable Access Time
35
ns
TCLZ1
CE# Low to Active Output
0
ns
TOLZ1
TCHZ1
OE# Low to Active Output
CE# High to High-Z Output
0
ns
20
ns
TOHZ1 OE# High to High-Z Output
20
ns
TOH1
Output Hold from Address Change
0
ns
TRP1
RST# Pulse Width
500
ns
TRHR1 RST# High before Read
50
ns
TRY1,2 RST# Pin Low to Read Mode
20
µs
T17.3 25018
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
2. This parameter applies to Sector-Erase, Block-Erase and Program operations. This parameter does not apply to Chip-
Erase operations.
Table 18:Program/Erase Cycle Timing Parameters
Symbol Parameter
Min
Max
Units
TBP
Word-Program Time
10
µs
TAS
Address Setup Time
0
ns
TAH
Address Hold Time
30
ns
TCS
WE# and CE# Setup Time
0
ns
TCH
WE# and CE# Hold Time
0
ns
TOES OE# High Setup Time
0
ns
TOEH OE# High Hold Time
10
ns
TCP
CE# Pulse Width
40
ns
TWP
TWPH1
TCPH1
WE# Pulse Width
WE# Pulse Width High
CE# Pulse Width High
40
ns
30
ns
30
ns
TDS
TDH1
TIDA1
Data Setup Time
Data Hold Time
Software ID Access and Exit Time
30
ns
0
ns
150
ns
TSE
Sector-Erase
25
ms
TBE
Block-Erase
25
ms
TSCE
TBY1,2
TBR1
Chip-Erase
RY/BY# Delay Time
Bus Recovery Time
50
ms
90
ns
0
µs
T18.1 25018
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
2. This parameter applies to Sector-Erase, Block-Erase, and Program operations.
©2011 Silicon Storage Technology, Inc.
20
DS-25018A
05/11