SLC810 Datasheet, PDF (3/7 Pages) Solid State Optronic – Linear Optocoupler

SLC810 Solder Temperature Profile Recommendations
SLC810
Single Channel
Linear Optocoupler
(1) Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Process
Step
A
B
C
D
E
F
G
H
Figure 1
Description
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
Parameter
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
(2) Wave Solder:
Maximum Temperature:
Maximum Time:
Pre-heating:
Single Occurrence
(3) Hand Solder:
Maximum Temperature:
Maximum Time:
Single Occurrence
260ºC (at terminal)
10s
100 - 150ºC (30 - 90s)
350ºC (at tip of soldering iron)
3s
© 2012 Solid State Optronics • San Jośe, CA
www.ssousa.com • +1.408.293.4600
Page 3 of 7
SLC810/S/TR
Rev 2.00 (07/30/2012)
001508