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S71AL016D Datasheet, PDF (41/76 Pages) SPANSION – Stacked Multi-Chip Product (MCP) Flash Memory and RAM
Advance Information
DC Characteristics
CMOS Compatible
Parameter
Description
Test Conditions
Min
Typ Max Unit
ILI
Input Load Current
ILIT
A9 Input Load Current
ILO
Output Leakage Current
ICC1
VCC Active Read Current
(Notes 1, 2)
VIN = VSS to VCC,
VCC = VCC max
VCC = VCC max; A9 = 12.5 V
VOUT = VSS to VCC,
VCC = VCC max
CE# = VIL, OE# = VIH,
Byte Mode
10 MHz
5 MHz
1 MHz
CE# = VIL, OE# = VIH,
Word Mode
10 MHz
5 MHz
1 MHz
±1.0
µA
35
µA
±1.0
µA
15
30
9
16
2
4
mA
18
35
9
16
2
4
ICC2
VCC Active Write Current
(Notes 2, 3, 5)
CE# = VIL, OE# = VIH
20
35
mA
ICC3
VCC Standby Current (Notes 2, 4) CE#, RESET# = VCC±0.3 V
ICC4
VCC Standby Current During Reset
(Notes 2, 4)
RESET# = VSS ± 0.3 V
0.2
5
µA
0.2
5
µA
ICC5
Automatic Sleep Mode
(Notes 2, 4, 6)
VIL
Input Low Voltage
VIH
Input High Voltage
VID
Voltage for Autoselect and
Temporary Sector Unprotect
VIH = VCC ± 0.3 V;
VIL = VSS ± 0.3 V
VCC = 3.3 V
–0.5
0.7 x VCC
11.5
0.2
5
µA
0.8
V
VCC + 0.3 V
12.5
V
VOL
VOH1
VOH2
VLKO
Output Low Voltage
IOL = 4.0 mA, VCC = VCC min
Output High Voltage
IOH = -2.0 mA, VCC = VCC min
IOH = -100 µA, VCC = VCC min
Low VCC Lock-Out Voltage (Note 4)
2.4
VCC–0.4
2.3
0.45
V
V
V
2.5
V
Notes:
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. Typical VCC is 3.0 V.
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. ICC active while Embedded Erase or Embedded Program is in progress.
4. At extended temperature range (>+85°C), typical current is 5 µA and maximum current is 10 µA.
5. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep
mode current is 200 nA.
6. Not 100% tested.
August 4, 2004 S29AL016D_00_A1_E
S29AL016D
41