S73WS256N Datasheet, PDF (221/251 Pages) SPANSION – Stacked Multi-Chip Product (MCP)

Preliminary
87 Basic Feature and Function Descriptions
87.1 Clock Suspend
CLK
CMD
CKE
Internal
CLK
DQ(CL2)
DQ(CL3)
WR
D0 D1
D0 D1
Masked by CKE
D2 D3
D2 D3
Not Written
Figure 87.1 Clock Suspend During Write
CLK
CMD
RD
CKE
Internal
CLK
DQ(CL2)
DQ(CL3)
Masked byCKE
Q0 ^DQ1
Q0
Q2
Q3
Q1
Q2 Q3
Suspended Dout
Figure 87.2 Clock Suspend During Read (BL = 4)
87.2 DQM Operation
CLK
CMD
WR
DQM
DQ(CL2)
DQ(CL3)
D0 D1
D0 D1
Masked by CKE
D3
D3
DQM to Data-in Mask = 0
Figure 87.1 Write Mask (BL = 4)
CLK
CMD RD
DQM
DQ(CL2)
DQ(CL3)
Masked by CKE
Q0 ^Hi-Z Q2 Q3
Hi-Z _{Q1 Q2 Q3}
DQM to Data-out Mask= 2
May 12, 2005 SDRAM_04_A0
S73WS256N Based MCPs
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