SKY65131_08 Datasheet, PDF (8/10 Pages) Skyworks Solutions Inc. – WLAN Power Amplifier Module

DATA SHEET • SKY65131
Cross Section
Name Thickness (mils) Material
ε_r
L1
1.4
Cu, 1 oz.
–
Lam1
12
Rogers 4003-12 3.38
L2_GND
1.4
Cu, 1 oz
–
Lam2
4
L3_GND
1.4
FR4-4
4.35
Cu, 1 oz.
–
Lam3
12
FR4-12
4.35
L4
1.4
Cu, 1 oz.
–
S573
Figure 13. Layer Detail Physical Characteristics
Pin 1
16X 0.4
4.3
16X 0.65
Pin 16
4.3
0.85 Typ
Pin 1
0.5 Typ
0.85 Typ
Thermal Via Array,
∅0.3 mm on 0.5 mm pitch
will improve thermal performance.
NOTE: thermal vias should
be tented and filled with solder
mask, 30-35 mm Cu plating
recommended.
All dimensions are in millimeters
Solder stencil aperture size for center
ground pad should be 60% to 80%
(by area) of mask opening.
Stencil Aperture
Top View
4.3
0.25 Typ
Pin 16
13X 0.65
13X 0.4
Component
Outline
16X 0.75
Pin 1
16X 0.5
0.3
4.3
0.85 Typ
4.4
Pin 16
0.2
0.5 Typ
Metallization
Top View
Component
Outline
0.45
2
Solder Mask Opening
Top View
Figure 14. PCB Layout Footprint for the SKY65131 4 x 4 mm MCM
2 4.4
S591
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
8
January 11, 2008 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 103106F