SKY65131_08 Datasheet, PDF (2/10 Pages) Skyworks Solutions Inc. – WLAN Power Amplifier Module

DATA SHEET • SKY65131
VCC1
VREF1
VREF2 VCC2
VC_BIAS
PA_ON
VCC_DET
Active Bias
Detector
V_DET
RF_IN
Input
Match
Stage 1
PA
Inter-Stage
Match
Stage 2
PA
Output
Match
RF_OUT
S107
Figure 2. SKY65131 Block Diagram
Technical Description
The SKY65131 PA contains all of the needed RF matching and DC
biasing circuits. The device also provides an output power
detector voltage and the ability to switch the PA on or off with a
simple control signal.
The SKY65131 is a two-stage, HBT InGaP device optimized for
high linearity and power efficiency. These features make the
device suitable for wideband digital applications, where PA
linearity and power consumption are of critical importance (e.g.,
WLANs).
The device has been characterized with the highest specified data
rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these
stringent test conditions, the device exhibits excellent spectral
purity and power efficiency.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY65131 is rated to Moisture Sensitivity Level 3 (MSL3) at
250 °C. It can be used for lead or lead-free soldering. Care must
be taken when attaching this product, whether it is done manually
or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second. Maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to ensure that the part is not
subjected to temperatures exceeding 250 °C for more than
10 seconds.
For details on both attachment techniques, precautions, and
handling procedures recommended by Skyworks, please refer to
Skyworks Application Note, PCB Design and SMT
Assembly/Rework Guidelines for MCM-L Packages, document
number 101752. Additional information on standard SMT reflow
profiles can also be found in the JEDEC Standard J-STD-020.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SKY65131 are provided in Table 2. Electrical specifications are
provided in Table 3.
Typical performance characteristics are shown in Figures 3
through 9. A schematic diagram of the SKY65131 Evaluation
Board is shown in Figure 10. A PCB layout footprint for the
SKY65131 is provided in Figure 14. Package dimensions for the
SKY65131 16-pin MCM are shown in Figure 15, and tape and reel
dimensions are shown in Figure 16.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
2
January 11, 2008 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 103106F