SKY65006 Datasheet, PDF (8/9 Pages) Skyworks Solutions Inc. – 3.3 V, 2.5 GHz Linear Power Amplifier

PRELIMINARY DATA SHEET • SKY65006
The application’s circuit board was constructed as a four-layer
FR4 stack with an overall thickness of 0.062 inches. Top layer
dielectric is 0.01-inch thick with 50 Ω transmission line widths
of 0.0195 inches. Printed circuit board was constructed using a
symmetrical 0.01-inch stack on the top and bottom layers and
with a 0.032-inch thick pre-preg core. All components were 0402
in size with the exception of the 4.7 µF and 10 µF Tantalum
capacitors. Please note that the 10 µF capacitors were installed
to provide low frequency filtering for lab testing. Actual values, if
necessary, will be dependent upon layout and circuit environ-
ment. All ground vias used were 0.012 inches in diameter and
placed as close to the ground ends of by-passing components as
possible. Four vias were used under the device to create a low
inductance path to ground. If a smaller diameter is to be used, or
if the substrate thickness is greater than 0.01 inches, additional
vias must be placed under the device to reduce the potential risk
of parasitic oscillation.
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape and Reel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
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May 14, 2007 • Skyworks Proprietary Information. • Products and product information are subject to change without notice. • 200122 Rev. D