SKY85402-11 Datasheet, PDF (7/13 Pages) Skyworks Solutions Inc. – Linear output power for IEEE 802.11ac 256-QAM

PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Package Dimensions
The PCB layout footprint for the SKY85402-11 is provided in
Figure 12. Typical part markings are shown in Figure 13. Package
dimensions are shown in Figure 14, and tape and reel dimensions
are provided in Figure 15.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY85402-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
202120I • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 2, 2018
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