SKY85402-11 Datasheet, PDF (10/13 Pages) Skyworks Solutions Inc. – Linear output power for IEEE 802.11ac 256-QAM

PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
0.70 Typ.
1
2
4.40
3
0.508 Typ.
4
5
4.40
2.60
0.25 Typ.
20 19 18 17 16
15
14
13 _2.60
12
11
0.70 Typ.
1
0.20 2
3
0.95 Typ.⁴
5
4.40
0.25 Typ.
20 19 18 17 16
15
14
13 4.40
12
11
6 7 8 9 10
4X 0.20
0.508 Typ.
0.500 Typ.
Package
Outline
25X ø0.25
Board Metal & Via Pattern
Top View (Note 4)
0.80 Typ.
1
2
4.50
3
4
5
4.50
0.35 Typ.
20 19 18 17 16
6 7 8 9 10
0.95 Typ.
0.500 Typ.
0.20
Package
Outline
Stencil Aperture
Top View (Note 5)
63% Solder Converage
On Center Pads
15
14
13 2.40
12
11
6 7 8 9 10
0.500 Typ.
2.40
Solder Mask Opening
Notes:
Top View (Note 6)
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hold recommendations: 30 to 35 μm Cu via wall plating, via holes
should be tented with solder mask on the backside and filled with solder.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures,
trapezoidal walls, and rounded corners offer better paste release.
6. Solder mask recommendations: contact board fabricator for recommended solder mask
offset and tolerance.
Package
Outline
Figure 12. PCB Layout Footprint for the SKY85402-11
S2701
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
10
June 2, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202120I