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SKY65342-11 Datasheet, PDF (7/13 Pages) Skyworks Solutions Inc. – 450-470 MHz Front-End Module
DATA SHEET • SKY65342-11 FRONT-END MODULE
Evaluation Board Description
The SKY65342-11 Evaluation Board is used to test the
performance of the SKY65342-11 FEM. The Evaluation Board
schematic diagram is shown in Figure 8. An assembly drawing for
the Evaluation Board is shown in Figure 9 and the layer detail is
provided in Figure 10. The layer detail physical characteristics are
noted in Figure 11. Table 6 provides the Bill of Materials (BOM)
list for Evaluation Board components.
from the device. Therefore, design the connection to the
ground pad to dissipate the maximum wattage produced by
the circuit board. Multiple vias to the grounding layer are
required.
NOTE: A poor connection between the slug and ground increases
junction temperature (TJ), which reduces the lifetime of the
device.
Circuit Design Considerations
The following design considerations are general in nature and
must be followed regadless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65342-11 has special electrical
and thermal grounding requirements. This pad is the main
thermal conduit for heat dissipation. Since the circuit board
acts as the heat sink, it must shunt as much heat as possible
Package Dimensions
The phone board layout footprint for the SKY65342-11 is shown
in Figure 12. Package dimensions for the 12-pin MCM are shown
in Figure 13, and tape and reel dimensions are provided in
Figure 14.
12
11
10
J2
SMA
1 TX_RFIN
9
V1
Switch Logic
2 GND
SKY65342-11
V2 8
Switch Logic
J3
SMA
3 RX_IN
J4
SMA
ANT 7
4
5
6
S1642
Figure 8. SKY65342-11 Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201139C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 26, 2009
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